PCB Brass Eyelets M0.9 × 3 mm (50pcs) – Tubular Hollow Rivets for Vias & Repairs

Description

PCB Rivet Brass Tubular Hollow Rivet (Eyelets, Vias) – M0.9 × 3 mm

These brass eyelets are designed for restoring or creating plated-through connections on printed circuit boards. The M0.9 × 3 mm size fits fine via work, strengthening through-holes and providing reliable inter-layer conductivity in prototyping, repair, and small-run production.

Available Variants

• M1.3 × 2.5 mm
• M1.3 × 3 mm
• M0.9 × 2.5 mm

Typical Applications

• Repairing lifted or damaged PTH/vias
• Reinforcing signal and ground vias
• Creating inter-layer connections during prototyping
• Mechanical strengthening of frequently-used holes

Specs

• Nominal size: M0.9 × 3 mm
• Shank diameter: ≈ 0.9 mm
• Overall length: 3 mm
• Material: Brass (high conductivity, corrosion-resistant)
• Finish: Plain brass

Installation (Quick Guide)

1. Drill/clear the via hole to ~0.9–1.0 mm as required.
2. Insert the eyelet from the component side.
3. Support the head and gently flare the tail using an eyelet setting tool or a small press.
4. Inspect continuity and, if needed, touch up with solder.

Note: Verify hole size, board thickness, and pad diameter against your design before installation. The 3 mm length suits many common PCB thicknesses; select length to match your board stack-up.